4 hours ago
NIDEC Advanced Manufacturing Technologies LineupNIDEC MACHINE TOOL AMERICA, a provider of advanced manufacturing technologies, rebrands its additive manufacturing unit as Advanced Manufacturing Technologies.
This rebranding emphasizes a company’s portfolio that includes conventional manufacturing processes on top of AM.
The newly named division brings three distinct technology platforms under one umbrella: LAMDA, the company’s metal additive manufacturing system; ABLASER, a high-precision laser micromachining system; and BOND MEISTER, a room-temperature wafer bonding machine built for semiconductor and MEMS applications.
A closer look at each technology
LAMDA is NIDEC’s Laser Powder DED Additive Manufacturing system, built for large-scale metal 3D printing. The series, comprising the LAMDA200, LAMDA500, LAMDA2000, and LAMDA5000, features advanced process control with AI anomaly detection for real-time monitoring and feedback, ensuring stability and repeatability throughout the build. Additionally, its local shield nozzle allows for the printing of reactive materials without a full inert gas enclosure, which simplifies setup and speeds up delivery.
The ABLASER is a laser micromachining system built around proprietary optical head technology and a prism rotator. This enables ultra-high precision helical machining, drilling micro-holes down to ⌀27 μm in materials like silicon, SiC, and ceramics with no thermal distortion. Its flexible taper hole control supports straight, forward taper, reverse taper, and hand-drum-shaped geometries.
BOND MEISTER joins wafers through surface activation bonding inside a high-vacuum environment; no heat is required. This eliminates thermal stress and distortion, allowing for the bonding of dissimilar materials like GaN, GaAs, and silicon. The lineup includes the MWB-04/06-R for research, prototyping, and small to medium volume production; MWB-04/06/08-AX for high-throughput production with fully automated cassette-to-cassette operation; and MWB-08/12-ST for 300 mm wafer bonding in high-volume applications.
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